Wanted · Wafer Bonding
EVG 850DB Debonder with UV-Laser Debond Module, 200mm
EV Group EVG 850DB debonding system with UV-laser debond module, 200mm configuration, working condition.
Requirement
A qualified buyer needs an EV Group EVG 850DB debonding system configured for 200mm wafers. The UV-laser debond module is required — systems without it do not meet this requirement.
Working condition required. Please include module configuration, laser source details, and service history when you reach out.
Have this equipment?
Email sloane@caladansemi.com — we respond same day. Include condition, configuration, location, and photos if you have them. Seller identity stays confidential.
Email sloane@caladansemi.comSpecifications Wanted
- Manufacturer
- EV Group (EVG)
- Model
- EVG 850DB
- Required module
- UV-laser debond
- Wafer size
- 200mm
- Condition
- Working
- Quantity
- 1
This is an anonymized requirement from a qualified buyer in our network. Buyer identity is never disclosed. All inquiries are handled confidentially.