Applied Materials
0200-40031 — Focus Ring, 300mm Silicon (DPS Etch) (Applied Materials)
Applied Materials
0200-40031 — Focus Ring, 300mm Silicon (DPS Etch) (Applied Materials)
Part No. 0200-40031
Market Price
Request Quote — No current market data
Our sourcing team will find pricing within 4 hours
Request Quote →Last verified: 2026-05-16
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Pricing
Price on request — quote in 4 hours
Market pricing for 0200-40031 — Focus Ring, 300mm Silicon (DPS Etch) (Applied Materials) moves with condition and availability. Our sourcing team will quote current pricing within 4 business hours.
How much does a used 0200-40031 — Focus Ring, 300mm Silicon (DPS Etch) (Applied Materials) cost in 2026?
Pricing for used 0200-40031 — Focus Ring, 300mm Silicon (DPS Etch) (Applied Materials) units varies by condition and configuration. Contact us for current 2026 market pricing. Get a quote.
Used Applied Materials Parts & Consumables vs. buying new: is it worth it in 2026?
Most buyers in 2026 choose used for cost and speed. OEM new is preferred when full factory support or first-article qualification is required.
What's included with a used 0200-40031 — Focus Ring, 300mm Silicon (DPS Etch) (Applied Materials) from Caladan Semi?
Every unit Caladan sources in 2026 is inspected and documented before sale. Here's what you get:
- ✓Functional test report and inspection photos
- ✓Available documentation (manuals, service records where available)
- ✓Availability: Available to Source — contact for current inventory
- ✓Export compliance documentation (EAR99 or ECCN classification provided)
0200-40031 Specifications and Compatible Tools
This 300mm silicon focus ring operates in 13.56MHz RF environments with 2,000W–4,000W forward power and <5% VSWR. It supports Cl₂/BCl₃/O₂ gas mixtures at 50–60sccm flow rates. Compatible tools include AMAT Centura DPS (1998–2005) and AMAT Centura DPS II (2003–2010). Do not use with 0200-40032 variants, which require different impedance matching networks. Verify the RF choke model (0200-40017A) for compatibility. DPS II systems require a 0200-40031B revision for high-density plasma modes. Always cross-check the etch chamber serial number to confirm DPS vs. DPS II configuration.
What to Check Before Buying a Used 0200-40031 in 2026
- RF-hour count: Reject units >40,000 hours; silicon fatigue increases plasma leakage.
- Surface inspection: Use a 10X loupe to check for cracks >0.2mm or delamination >5% surface area.
- Impedance test: Measure with an LCR meter; Z must be 50–60Ω @ 13.56MHz.
- Gas flow uniformity: Test with a mass flow controller; deviation >10% from 50sccm indicates erosion.
- Plasma uniformity scan: Run a 300mm wafer profilometer test; >15% non-uniformity requires reprofiling.
- Installation year: Units installed pre-2012 may lack the 0200-40031-RevC edge contour upgrade.
Q: Is 0200-40031 better than 0200-40032 for DPS Etch?
A: Yes. The 0200-40031 is designed for DPS systems, while 0200-40032 is for AMAT’s Indus platform. Mixing parts causes RF mismatch and arcing.
Q: Why is 0200-40031 pricing dropping in 2026?
A: OEM shift to 450mm tools and increased used inventory from decommissioned DPS lines.
Q: How long for delivery after purchase?
A: 2–4 weeks post-sourcing, pending RF testing and shipping logistics.
Q: Can I use this on a 200mm wafer system?
A: No. The 300mm design alters edge plasma coupling, causing defects. Use 0200-40029 for
Recent Market Listings
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