SUSS
Used SUSS SB6 150mm Wafer Bonder: Buyer Checklist
SUSS
Used SUSS SB6 150mm Wafer Bonder: Buyer Checklist
Part No. Suss Karl Suss Microtec Sb6 Wafer To Wafer Bonder 150Mm
Market Price
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Pricing
Price on request
Request pricing for Used SUSS SB6 150mm Wafer Bonder: Buyer Checklist. The quote must confirm configuration, condition, availability and applicable terms.
How much does a used Used SUSS SB6 150mm Wafer Bonder: Buyer Checklist cost in 2026?
Pricing for used Used SUSS SB6 150mm Wafer Bonder: Buyer Checklist units varies by condition and configuration. Contact us for current 2026 market pricing. Get a quote.
What should I confirm before buying used SUSS None?
Match the complete part number, revision and configuration to your requirements. Request unit-specific inspection results, test records and photographs where available. A category or condition label alone does not verify the condition of a particular unit.
What terms apply to a quote for Used SUSS SB6 150mm Wafer Bonder: Buyer Checklist?
Ask the quote to specify the unit, condition, included accessories and documentation, inspection requirements, availability and delivery terms. Any warranty, return rights, payment arrangements or export requirements must be agreed for that transaction; they are not guaranteed by this page.
Evaluate a used SUSS SB6 against your bond process and the actual unit's documentation. Request the nameplate, generation, installed options, fixture inventory, and a demonstration plan before agreeing to purchase.
What does the 150mm designation establish?
NIST documents its SUSS MicroTec SB6 Gen2 as a substrate bonder accommodating wafers up to 150 mm. That reference describes NIST's Gen2 configuration, not the identity or condition of a unit offered here.
Do not apply Gen2 specifications to another SB6 generation without a matching manual and configuration record. Ask the seller to identify the precise system before comparing temperature, force, vacuum, alignment, or software requirements.
Match the bonder to your process
Prepare a requirements sheet with your substrate dimensions and materials, proposed bond method, temperature and force requirements, atmosphere, and alignment target. Have your process engineer compare it against the offered configuration and flag every undocumented requirement.
Request an itemized list of fixtures, tooling, controllers, cables, pumps, and installation documentation. For any separately offered aligner or activation tool, ask for an interface review before treating it as part of the process flow.
Compare the SB6e reference page and SUSS PL12 plasma activation page as separate equipment inquiries, not as confirmed substitutes or compatible accessories.
Set acceptance criteria before purchase
- Identity and completeness: Match the photographed nameplate and accessory list to the written quote.
- Controls and records: Request a witnessed startup, alarm-history review, and demonstration of recipe access using the included controller.
- Process demonstration: Agree representative test substrates, recipe, measurement methods, and engineer-approved pass limits before testing.
- Condition: Request inspection and service records for the bonding assembly, fixtures, seals, and utility connections.
- Handover: Specify what happens if a test fails, who packs the equipment, and what installation assistance is included.
Use the equipment inspection checklist to organize the acceptance record. Avoid universal cycle-count, age, or leak-rate cutoffs without a relevant maintenance specification.
Request a configuration-specific quote
Provide the required bond process, substrate dimensions, site utilities, and delivery location through the quote form. Ask for an itemized price, documented condition, availability confirmation, and proposed delivery terms for the identified unit.
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