Confirm condition, inspection evidence and commercial terms in the quote.

SUSS MicroTec

SUSS MicroTec SB6e Wafer Bonder | Buying Checks

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SUSS MicroTec

SUSS MicroTec SB6e Wafer Bonder | Buying Checks

Part No. SB6e

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✓Request unit-specific inspection and test records
✓Confirm included documentation and accessories
✓Agree delivery, payment and return terms in the quote

Pricing

Price on request

Request pricing for SUSS MicroTec SB6e Wafer Bonder | Buying Checks. The quote must confirm configuration, condition, availability and applicable terms.

How much does a used SUSS MicroTec SB6e Wafer Bonder | Buying Checks cost in 2026?

Pricing for used SUSS MicroTec SB6e Wafer Bonder | Buying Checks units varies by condition and configuration. Contact us for current 2026 market pricing. Get a quote.

What should I confirm before buying used SUSS MicroTec Wafer Bonding?

Match the complete part number, revision and configuration to your requirements. Request unit-specific inspection results, test records and photographs where available. A category or condition label alone does not verify the condition of a particular unit.

What terms apply to a quote for SUSS MicroTec SB6e Wafer Bonder | Buying Checks?

Ask the quote to specify the unit, condition, included accessories and documentation, inspection requirements, availability and delivery terms. Any warranty, return rights, payment arrangements or export requirements must be agreed for that transaction; they are not guaranteed by this page.

What to match before buying an SB6e

The SUSS MicroTec SB6e is a semi-automatic wafer bonder for substrates up to 150 mm; the paired SB8e model is described separately for 200 mm wafers.

For a used purchase, ask for the serial number and an itemized configuration before comparing offers. Have your process engineer specify the substrate pair, wafer diameter, stack thickness, bond method and required alignment result. Request evidence for the offered machine, not just a family brochure.

  • Tooling: Request photographs and part numbers for the installed chucks, loading fixture and any alignment-transfer hardware. Compare them with your intended substrate stack.
  • Process options: Ask which bonding processes the offered configuration has demonstrated, and request its option list, manuals and recent recipe records.
  • Controls and utilities: Obtain software versions, access requirements and the serial-specific installation checklist. Assign responsibility for setup and calibration before purchase.

Agree on acceptance before shipment

Write a witnessed acceptance plan around your own sample stack. Specify how to measure post-bond alignment, bond quality and repeatability, and agree on pass/fail limits with your engineer and the seller. Request the raw results, sample identification, recipe, calibration dates and any exceptions.

Include checks of chamber operation, heating, applied force and safety interlocks using the approved service procedure. Ask for a complete accessories inventory and a record of dismantling and packing. Put responsibility for installation and a repeat acceptance run at your site in the purchase terms.

What to include in an SB6e quote request

Send your target process, wafer size, required fixtures, destination and acceptance plan. Ask the seller to separate the machine, tooling, inspection, packing, freight and installation costs. Obtain written condition, warranty, availability and dispatch terms for the identified serial number.

Buyer questions

Does an SB6e listing prove it can run my process?

Require the installed-option record and a sample run against your acceptance plan before treating the offer as a process match.

Should I accept an SB6 or SB8e as a substitute?

Keep any alternative model as a separate engineering review. Do not approve a substitution from a similar model name alone.

Related buying resources

Part identity

Part number
SB6e · Source
Manufacturer
SUSS MicroTec · Source

Quick Info

ConditionConfirm in quote
CategoryWafer Bonding

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